| 1. |
- Abgrall, N., et al.
(author)
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The large enriched germanium experiment for neutrinoless double beta decay (LEGEND)
- 2017
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In: AIP Conference Proceedings. - : Author(s). - 1551-7616 .- 0094-243X. ; 1894
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Conference paper (peer-reviewed)abstract
- The observation of neutrinoless double-beta decay (0νββ) would show that lepton number is violated, reveal that neu-trinos are Majorana particles, and provide information on neutrino mass. A discovery-capable experiment covering the inverted ordering region, with effective Majorana neutrino masses of 15 - 50 meV, will require a tonne-scale experiment with excellent energy resolution and extremely low backgrounds, at the level of ∼0.1 count /(FWHM·t·yr) in the region of the signal. The current generation 76Ge experiments GERDA and the Majorana Demonstrator, utilizing high purity Germanium detectors with an intrinsic energy resolution of 0.12%, have achieved the lowest backgrounds by over an order of magnitude in the 0νββ signal region of all 0νββ experiments. Building on this success, the LEGEND collaboration has been formed to pursue a tonne-scale 76Ge experiment. The collaboration aims to develop a phased 0νββ experimental program with discovery potential at a half-life approaching or at 1028 years, using existing resources as appropriate to expedite physics results.
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| 3. |
- Andersson, Cristina, 1969, et al.
(author)
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Characterization of Mechanical Properties of Eutectic Sn-Co-Cu Lead Free Alloy
- 2006
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In: Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany. - 9781424405527 ; , s. 152-160
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Conference paper (peer-reviewed)abstract
- The Sn-Co-Cu eutectic solder alloy is a less expensive and is therefore a possible alternative to the Sn-Ag-Cu alloys. The Sn-Co-Cu system eutectic composition was obtained by means of CALPHAD (CALculation of PHAse Diagram) methodology. The composition of the Sn-rich, eutectic Sn-Co-Cu system was found to be 0.4%Co and 0.7%Cu (wt%) with a melting point of 224°C. The tensile behavior of the eutectic Sn-0.4Co-0.7Cu bulk samples was studied under three different conditions of strain rates (10 -6 , 10 -4 and 10 -3 /s) and compared to both Sn-37Pb and Sn-4.0Ag-0.5Cu alloys. The evaluation of the tensile results showed that the effect of strain rate played an important roll on the tensile properties of these alloys, and it is clearly observed that the tensile strength increases as the strain rate increases. Furthermore, Sn-4.0Ag-0.5Cu alloy shows better Ultimate Tensile Strength (UTS) followed by Sn-37P and Sn-0.4Co-0.7Cu system. © 2006 IEEE.
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| 5. |
- Andersson, Cristina, 1969, et al.
(author)
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Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of Sn-3.8Ag-0.7Cu solder joints
- 2005
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In: 15th European Microelectronics and Packaging Conference and Exhibition, EMPC 2005 - Conference Programme and Proceedings. ; 2005, s. 523-528
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Conference paper (peer-reviewed)abstract
- Temperature cycling of real electronic components was carried out in a systematic manner at two different temperature profiles and in a single-chamber Heraeus climate cabinet. The first temperature profile ranged between -55°C and 100°C and the second between 0°C and 100°C. Top-side SMD components (chip resistors and Ball Grid Arrays (BGA)) were soldered with Sn-3.8Ag-0.7Cu lead free solder paste. Crack initiation and propagation was analyzed after every 500 cycles for each temperature cycling profile. Totally, 6500 cycles were run at both temperature profiles. Finite element modeling (FEM) calculations, for the analysis of strain and stress of 1206 chip joints were used to corroborate the experimental work results, especially regarding the crack initiation sites. Cracks were firstly visible for the temperature cycling ranging between -55°C and 100°C. The cracks observed were also visibly smaller for the temperature profile ranging between 0°C and 100°C, concluding that crack initiation and propagation was slightly slower for this temperature profile. Cracks continued to propagate as a function of temperature cycles. The reason for this difference in crack initiation and propagation was also analyzed.
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| 6. |
- Andersson, Cristina, 1969, et al.
(author)
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Low Cycle Fatigue Behavior of Sn-4.0Ag-0.5Cu Lead-free in Corrosive Environmental Conditions
- 2006
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In: ESTC 2006 - 1st Electronics Systemintegration Technology Conference; Dresden, Saxony; Germany; 5 September 2006 through 7 September 2006. - 9781424405527 ; , s. 457-467
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Conference paper (peer-reviewed)abstract
- Isothermal low cycle fatigue experiments of lead free Sn-Ag-Cu solder joints were executed in different corrosive environmental conditions. The environments/factors varied were temperature, humidity and salt application on to the solder joints. The experiments were executed according to a full factorial design of experiments where the three different factors and two levels for each factor were varied according to literature. The outcome of the design of experiments was the number of cycles to failure defined as 50% load drop. The main goal with this work was to analyze the fatigue behavior of this solder material as a function of the different corrosive environments, and simultaneously to analyze its corrosion behavior/resistance. The factor with the highest effect on the fatigue life was salt application followed by temperature. The factor humidity was not significant for the tests performed.
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| 7. |
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| 8. |
- Andersson, Cristina, 1969, et al.
(author)
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Low Cycle fatigue of lead-free solders
- 2001
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In: The Fourth International Symposium on Electronic Packaging Technology. ; , s. 462-470
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Conference paper (peer-reviewed)
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